Radiation hardening is defined as the act of manufacturing electronic components and can withstand the damage caused by ionizing radiation such as particle radiation, and high energy electromagnetic radiation. These products are classically tested one or more resultant effect tests, including total ionizing dose, enhanced low dose rate effects, and single event effects.
Increase in global intelligence, surveillance & reconnaissance operations is the key driving factor which is expected to boost the global radiation-hardened electronics market growth. Furthermore, increase in advancements in FPGA & multicore processor technologies for defense and space applications will have the positive impact on market growth. Moreover, increase in research and development activities across the globe will propel the market growth. In addition to that, growing requirements for reconfigurable Rad-Hard Components will drive the market growth.
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However, high costs of development and design is the major restraining factor which is expected to hinder the global radiation-hardened electronics market growth. Also, difficulties in creating actual testing environment will affect the market growth.
Global Radiation-Hardened Electronics Market is segmented into component such as Microprocessor, Memory, FPGA, and Sensors. Further, market is segmented into application such as Aerospace & Defense, and Nuclear Power Plants.
Also, Global Radiation-Hardened Electronics Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa.
Market Key Players
Various key players are discussed in this report such as
- BAE Systems PLC,
- Honeywell Aerospace
- Microsemi Corp.
- Microchip Technology Inc.
- Xilinx, Inc.
- Texas Instruments, Inc.
- St Microelectronics NV
- Maxwell Technologies, Inc.
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